Server technology innovator Super Micro Computer Inc. has released a low power, compact form factor embedded server platform (Model #5017P-TLN4F) based on its new Mini-ITX (6.7 inches by 6.7 inches) motherboard (Model #X9SPV-F/LN4F). The embedded server aims to enable increased storage I/O performance with SSD caching.
Compared to the previous generation architecture, this solution delivers 15 percent more processing performance, up to 50 percent more 3D graphics performance (supporting the latest graphic APIs, including DX11, OpenCL 1.1 and OpenGL 3.1) and new features including Intel Smart Response Technology.
The X9SPV-F/LN4F embedded server platform features the following:
- Mobile, 3rd generation Intel Core i7/i5/i3 processors and Mobile Intel QM77 Express Chipset.
- Dual/quad core 1.6 GHz to 2.7 GHz 35W and 25W M Series and 17W U Series processor options.
- Up to 16 GB ECC DDR3-1066/1333MHz in dual vertical SO-DIMMs.
- 1 PCI-E 3.0 x16 slot (i3 2.0 only).
- 2 SATA 6Gbs/ and 4 SATA 3Gbs/ Ports (RAID 0/1/5/10).
- VGA Output; Matrox G200eW (default) or Intel Integrated Graphics (DX11) via BIOS setup.
- Quad Gigabit LAN Ports.
- IPMI 2.0 with dedicated LAN.
- 4 USB 3.0 ports, 6 USB 2.0 ports (four rear, two header).
- SATA DOM (Disk on Module) Power connector.
Supermicro’s newest compact short-depth enclosure (Model #SC504-203B) features a 3.5-inch or two 2.5-inch SATA2 drive bays, a 200-Watt Supermicro power supply, and PCI Express 3.0 x16 expansion capability on riser. When combined with the X9SPV-F/LN4F embedded server platform, the resulting embedded server appliance is ideal for such applications as storage head nodes, media transcoding, HD video conferencing, network monitoring, security, firewall management, and a variety of other space- and power-constrained applications.
“Supermicro offers server class reliability and performance to the embedded server appliance market with low-power solutions and long-life cycle support and availability,” says Wally Liaw, Supermicro’s vice president of international sales. “Our latest compact solution is optimized to deliver maximum performance with increased energy efficiency. It offers full support of 3rd generation Intel Core processors based on Intel’s 22nm process technology and 3D Tri-Gate transistors.”
Intel says this sort of embedded service applications are designed to provide performance and I/O capabilities. “The X9SPV-F/LN4F embedded server platform enables highly optimized solutions for customers across a broad spectrum of workloads and segments, including Green Computing,” says Intel Intelligent Systems Group marketing director Matt Langman.
