Samsung Electronics, announced that it is the first in the industry to begin volume production of modules containing a 16 gigabit (Gb) monolithic 64 gigabyte (GB) DDR4 memory solution. The new registered dual in-line memory module (RDIMM), which is designed primarily for use in enterprise and cloud server applications, will be shown at the HPE Discover Las Vegas conference and exhibition June 19-21 at the Venetian-Palazzo Resort Center in Booth #170.
“Large data centers are increasingly embracing Big Data, high-speed mobility, IoT, deep learning, AI and cloud-native technologies, with Samsung and other leaders like HPE and AMD delivering integrated solutions that are faster, denser, more scalable, and more power-conserving,” said Sewon Chun, senior vice president of memory marketing at Samsung Electronics. “At Samsung, we are taking the industry to new horizons with our 16Gb, 64GB RDIMMs and other leading-edge memory and storage solutions in helping to fully enable the real-time needs of leading enterprise OEMs (original equipment manufacturers) worldwide,” he added.
The HPE ProLiant DL385 Gen10 server based on the AMD EPYC 7000 processors will be the first major server platform in the industry qualified to use 64GB RDIMMs based on the new Samsung 16Gb technology, providing up to two terabytes (TB) of memory in a two-processor, 32-DIMM configuration with the 16Gb, 64GB solution. In addition, HPE announced its single-processor HPE ProLiant DL325 Gen10 server on June 5, for which Samsung’s 16Gb technology is being qualified before its official introduction next month. This further broadens the HPE portfolio of AMD-based platforms with the HPE ProLiant DL325 Gen10 server using the 16Gb, 64GB RDIMM solution to achieve one TB of DDR4 memory, making it ideal for virtualization and software-defined storage workloads.
Samsung’s 16Gb-based 64GB RDIMM delivers high capacity, high performance and low power in the first-ever JEDEC-standard configuration to achieve this density.
The Samsung 16Gb monolithic 64GB RDIMM provides a boost in performance over that of an 8 Gb monolithic chip at double the density, featuring raw speeds of up to 2666MT/s, with future releases expect to easily surpass that. In addition, it consumes 19 percent less power compared to a similar-density implementation using two 32GB RDIMMs.
“HPE has a long history of selecting and collaborating with strong strategic partners to deliver innovative technology that enables our customers to more rapidly bring to market new products and services,” said Tom Lattin, vice president of HPE Mass Market Platforms, Options, and Software. “By featuring Samsung’s market-leading 16Gb 64GB RDIMMS on HPE ProLiant DL385 and ProLiant DL325 Gen10 servers based on the AMD EPYC processors, Samsung, AMD, and HPE are partnering to advance the state of the art for higher performance with lower TCO, addressing the demands of today’s leading applications.”
Samsung said that it will also soon begin sampling 16Gb-based 256GB DIMMs, which would expand the memory capacity for a 2P server to as much as 8TB. Sampling is projected to be completed by year end.
