Collectively, SKUs in Xeon Scalable family are designed for an emerging data center landscape in which workloads will reside in a mix of settings with equally diverse requirements, according to Navin Shenoy, executive vice president and general manager of Intel’s Data Platforms Group.
“The data centers of the future will look very different from how they do today,” said Shenoy this morning. “They’ll be more distributed in size and location, built on both public and private clouds. Compute, storage, and memory will be increasingly disaggregated, leveraging pools of connected infrastructure. Security will be architected in at the chip level. Flexibility will extend across hardware, software, applications, and services deployed as smaller units called microservices for the faster development time and time to value. CPUs and XPUs will work closely together to solve increasingly complex problems across these distributed environments.”
Intel shipped more than 200,000 3rd Gen Xeon Scalable units in the first quarter of the year, Intel says. Microsoft, Google, and other public cloud leaders will introduce virtual machines powered by the new chips soon, as will over 20 high-performance computing labs and HPC-as-a-service providers.
Today’s launch comes shortly after the unveiling of “IDM 2.0,” an integrated device manufacturing model that will see Intel spend some $20 billion on two new fabs in Arizona and offer outsourced foundry capacity to global customers while making expanded use of third-party foundry capacity itself.
It also comes weeks after AMD released a third generation of its 7nm EPYC server processors offering accelerated performance and enhanced security.