With the latest release of the integrated business management solution, SAP takes another step in executing its cloud strategy, and builds on feedback from partners and customers.
Following its bi-yearly release strategy, SAP makes the latest version of the SAP Business ByDesign solution generally available. Designed for growing midmarket companies that do not want to manage a large IT infrastructure, the software-as-a-service solution is now available in Australia and Mexico, and includes language support for Spanish. Mobile support is also planned to cover the Windows 7 platform.
The latest feature pack for SAP Business ByDesign also features:
- Community-driven enhancements: SAP has continually collected customer requirements over the years, more than 500 of which have been incorporated into the two feature packs released in 2011. SAP is also now offering a global community platform in English for its customers and partners to provide their ideas and requests for future enhancements of the solution. A Chinese version is planned for later this year.
- Additional professional service functionality: Key enhancements include customer contract management, support for managed services, and enhanced revenue recognition automation.
- Extended flexibility through co-innovation: The SAP partner network is using the software development kit to develop and deploy customer- and industry-specific add-on functionality.
- Procure-to-pay with integration to SAP Business Suite software: Subsidiaries of headquarters working with SAP Business Suite are a key target group for SAP Business ByDesign, so the company has expanded the number of preconfigured integration scenarios. A new integration scenario supports automated procurement processes between subsidiaries and headquarters. As customer orders come into a subsidiary, purchase orders can be sent electronically from the subsidiary system to SAP Business Suite software at the headquarters. Preconfigured installations offer fast, out-of-the-box integration with SAP Business Suite.