New Thermal Management Materials for Portable Computing Devices from Honeywell
The company’s thermal management material helps manage the heat produced by powerful semiconductors in laptops and netbooks.
Honeywell Electronic Materials announced a new printable thermal management material designed to help manage the tremendous heat produced by increasingly powerful semiconductors in portable computing devices such as laptops and netbooks.
Honeywell develops thermal management solutions that transfer and dissipate heat, and the new material, Honeywell PCM45M-SP, builds on Electronic Materials’ existing line of thermal management materials. As semiconductors become more powerful and smaller, more heat is being generated in the confined spaces where semiconductors are packaged for end-use applications. This heat can damage the semiconductor or degrade its performance, and it can damage the device as well.
“Mobile computing devices such as laptops and netbooks are placing increased demands on thermal management materials to enable high performance and ensure a long lifespan,” says Tim Chen, packaging leader for Honeywell Electronic Materials. “To meet that challenge, we have combined our… phase-change chemistry with an innovative formulation specifically designed for these types of mobile devices.”
In typical mobile computing applications, chip temperature rises steeply at start-up and remains high during operations. PCM45M-SP is designed to meet these specific thermal management requirements.
PCM45M-SP can withstand more than 1,000 hours at 150 degrees C without degradation and more than 1,000 temperature cycles, according to Honeywell Electronic Materials. The application is not limited to heat sink design, and the material may be applied to a component, heat sink, or thermal spreader in any shape built into the printing screen. Additionally, the enhanced stability of this new material minimizes or eliminates the need for pre-mixing, conserving time and resources, according to the company.
The PCM45M-SP phase change thermal interface consists of a thermally conductive material with optimum filler size distribution to achieve maximum packing density compared with conventional phase change materials. PCM45M-SP changes phase at 45 degrees C to ensure maximum surface conformance.
For more information, visit www.honeywell.com/em.