Topic: Hardware - Page 255

SEOUL, South Korea–(BUSINESS WIRE)–Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced the launch of its latest premium application processor (AP), the Exynos 9 Series 8895. This is Samsung’s first processor chipset to take advantage of the most advanced and industry leading 10-nanometer (nm) FinFET process technology with improved 3D transistor structure, which allows up to 27% higher performance while consuming 40% less power when compared to 14nm technology.

— Unleashing the Full Potential of the Qualcomm Snapdragon 835 Mobile Platform for Designed Developers to Create Immersive VR Experiences–

Snapdragon X20 LTE Modem is World’s First Chipset to Support LTE Category 18 with Download Speeds up to 1.2Gbps, Paving the way for 5G

Company Ships Multimode GaAs Power Amplifier Modules and First Dynamic Antenna Tuning Solution for Carrier Aggregation

—Features Advanced Hardware Security and Support for ZigBee 3.0 and Thread with Coexistence across Multiple Wireless Standards and Software Ecosystems—

–Powerful connectivity for Android Things OS to help facilitate Development of Always-Connected IoT Devices–

5-4-3 Innovation Acceleration process allows partners to rapidly scope, design, produce and test working IoT prototype devices for their customers

Santhosh Nair to Lead IoT R&D; Product to Launch Later This Year

New TC51-HC mobile computer and DS8100-HC series scanners provide improved workflows for healthcare professionals and better patient experiences

SAN FRANCISCO, February 20, 2017 /PRNewswire/ —