- 1 of 4
- next ›
This morning, Navin Shenoy (pictured), executive vice president and general manager of Intel’s Data Platforms Group, pulled the wraps off the 3rd Gen Xeon Scalable platform, aka “Ice Lake,” Intel’s latest set of data center processors. The new chips, which are designed for use with a diverse mix of hybrid cloud, artificial intelligence, 5G, and edge computing workloads, are already featured in a range of servers from leading manufacturers. Here are some of the products three of those OEMs—Hewlett Packard Enterprise, Lenovo, and Supermicro—unveiled today.
Related News
Related Features
More Galleries like This
With stunning AV systems installed by CompView Audio Visual, this school's new athletic center is unlike any other.
Most wouldn’t confuse a thumb drive for a NAS, but NAS and DAS often look alike. We take a look at 5 excellent multibay DAS devices.
The best apps to standardize your office on Android and iOS mobile devices.
Our smartphones can do a lot of things-some utilitarian, some a little more unusual...
And not just due to coronavirus-fueled demand for work-from-home gear, either. According to senior VP Linda Rendleman (pictured), high-speed mobile networks and endpoint management remain opportunities despite the stalled economy too.