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In the biggest rollout of all, Supermicro introduced more than 100 application-optimized systems featuring Intel’s latest data center chips.
The new X12 series includes high-performance Ultra and Hyper models; Ultra-E and Hyper-E units for edge computing and 5G deployments; and SuperBlade, CloudDC, and BigTwin (pictured) devices for cloud workloads. There are also GPU systems designed to capitalize on the 3rd Gen Xeon Scalable platform’s PCIe Gen4 support; highly integrated 4U, 8 GPU systems for large training workloads; and 2U, dual-node, single processor GPU systems with improved power efficiency for cloud gaming and streaming.
Supermicro has architected Oracle Linux and SAP-certified solutions equipped with 3rd Gen Xeon Scalable processors coming soon as well.
Early adopters have been using products from the X12 series for months. “The performance is looking good,” says Vik Malyala, the manufacturer’s senior vice president for field application engineering. “People seem to be happy.”
The 3rd Gen Xeon Scalable portfolio’s flexibility, he adds, aligns well with Supermicro’s long-standing emphasis on offering a diverse range of purpose-specific SKUs. “That’s where we shine,” he says. “When we pair that with Intel Ice Lake, we are able to bring the right solutions for our customers.”
Supermicro’s haul of products for the AMD EPYC 7003 Series included models optimized for hyperconverged infrastructure, software-defined storage, data management, analytics, and high-performance computing.
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Exhibits in the conference’s sprawling expo hall, including this IoT-enabled bus, provided concrete examples of the pre-packaged and outsourced offerings resellers can get from SYNNEX these days along with plain old hardware and software.
Cisco, Dell EMC, HPE, Lenovo, and Supermicro are among many OEMs with products bearing AMD EPYC 7003 Series processors in market or shipping soon.