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This morning, Navin Shenoy (pictured), executive vice president and general manager of Intel’s Data Platforms Group, pulled the wraps off the 3rd Gen Xeon Scalable platform, aka “Ice Lake,” Intel’s latest set of data center processors. The new chips, which are designed for use with a diverse mix of hybrid cloud, artificial intelligence, 5G, and edge computing workloads, are already featured in a range of servers from leading manufacturers. Here are some of the products three of those OEMs—Hewlett Packard Enterprise, Lenovo, and Supermicro—unveiled today.
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At the company’s April 22 Partner Connect event, executives including CEO Pat Gelsinger (pictured) discussed continued PC market momentum, ongoing inventory shortfalls, forthcoming product launches, and the recently introduced Intel Partner Alliance.